The invention discloses a chemical nickel-palladium alloy plating process for circuit boards. The chemical nickel-palladium alloy plating process is characterized by comprising the following steps: (1) degreasing: placing a circuit board in an acidic degreasing agent to remove greasy dirt and fingerprints on the surface of the circuit board; (2) microetching: placing the degreased circuit board in microetching liquid to slightly etch the copper surface; (3) activation: placing the micro-etched circuit board in a palladium activating liquid to be activated, so that a layer of activated palladium is deposited on the surface of the circuit board; (4) chemical nickel plating: placing the activated circuit board in nickel plating liquid so as to deposit a layer of nickel on the copper surface; (5) microetching: placing the circuit board plated with nickel in acid liquid so as to slightly etch the nickel surface; (6) activation: placing the micro-etched circuit board in the palladium activating liquid to be activated, so that a layer of activated palladium is deposited on the surface of the circuit board; (7) chemical nickel-palladium plating: placing the activated circuit board in nickel-palladium alloy plating liquid to be plated, and depositing a nickel-palladium alloy plated layer on the nickel surface; (8) washing and drying the circuit board: washing the board surface to remove medicine liquids in former preparation processes, and drying. Through the adoption of the chemical nickel-palladium alloy plating process disclosed by the invention, the production cost can be reduced effectively, and the application of the surface treatment process of circuit boards is facilitated.