The invention aims to provide a module which is high in reliability when connected with external parts. The module (1) includes a circuit board (2); a resin layer (4a) arranged on a main surface of the circuit board (2); an external connection conductor (6) arranged in the resin layer (4a) wherein one end of the external connection conductor (6) is connected with the circuit board (2), and the other end protrudes out from the surface of the resin layer (4a) and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer; and a solder bump (7) formed on the other end side of the external connection conductor (6). Consequently, when the module (1) is subjected to stress in an external connecting state, the low-mechanical-strength connecting interface between the external connection conductor (6) and the solder bump (7) is staggered with a stress concentrated portion, so that the reliability of the connection between the module (1) and the external parts is improved.