A silicon-containing curable resin composition which comprises: as component (A), an epoxy siloxane compound containing at least two epoxy-containing groups per molecule and a group represented by general formula (1); as component (B), an epoxy siloxane compound containing 1 to 10 silicon atoms and at least two epoxy-containing groups per molecule; and as component (C), an epoxy curable compound. In general formula (1), R1 to R4 are the same or different and represent an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 10 carbon atoms, and a is a number of 20 to 10,000.