Provided are a wiring substrate that meets the demand for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure in which an electronic component is mounted on the wiring substrate or the component embedded substrate. The wiring substrate is provided with a metal plate (2), and a wiring layer (5) that has a plurality of insulating layers (3) and a conductive layer (4) arranged on the plurality of insulating layers (3) and is arranged on at least one principal surface of the metal plate (2). The plurality of insulating layers (3) in the wiring layer (5) has a first insulating layer (6) which is provided so as to contact the principal surface of the metal plate (2) and has a larger thermal expansion rate in the planar direction than the metal plate (2) and a second insulating layer (7) which is laminated on the first insulating layer (6) so as to contact the first insulating layer (6) and has smaller thermal expansion rate in the planar direction than the metal plate (2). The first insulating layer (6) includes a resin (8). The second insulating layer (7) includes a plurality of first particles (10) that are made of an inorganic insulating material and mutually connected, and has a part of the first insulating layer (6) arranged in a gap between the plurality of first particles (10).