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CN103681574B 引线框、气腔封装和带有偏移通气孔的电子器件及其制作方法 有权 转让

引线框、气腔封装和带有偏移通气孔的电子器件及其制作方法
摘要：
本发明涉及引线框、气腔封装和带有偏移通气孔的电子器件及其制作方法。（例如，包含在器件封装中的）引线框（300,700）包括具有通气孔（336,736）的部件（例如，管芯焊盘或引线），通气孔形成在第一表面和与第一表面相对的第二表面（410，412）之间。通气孔的横截面积在表面之间明显变化（例如，通气孔具有收缩部分）。通气孔可以由第一开口（420）和第二开口（430）形成，第一开口从第一表面朝向第二表面延伸到小于引线框部件的厚度的第一深度（452），第二开口从第二表面朝向第一表面延伸到第二深度，第二深度小于引线框部件的厚度，但大得足以使第二开口交叉第一开口。开口的垂直中心轴（428，429）彼此水平地偏移，并且通气孔的收缩部分对应于开口的交叉部分。
摘要（英）：

A leadframe (300, 700) (e.g., incorporated in a device package) includes a feature (310, 322, 710, 722) (e.g., a die pad or lead) with a vent hole (336, 736) formed between first and second opposed surfaces (410, 412). The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion (460)). The vent hole may be formed from a first opening (420) extending from the first surface toward the second surface to a first depth (452) that is less than a thickness (450) of the leadframe feature, and a second opening (430) extending from the second surface toward the first surface to a second depth (454) that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes (428, 429) of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

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