知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN103620778A 倒装芯片、正面和背面中心键合存储线键合组件 失效 - 权利终止

倒装芯片、正面和背面中心键合存储线键合组件
摘要：
一种微电子组件10可以包括具有第一表面34、第二表面58、在其间延伸的孔39以及端子36的衬底30。组件10还可以包括具有面对第一表面34的前表面16的第一微电子元件12、具有突出于第一微电子元件的边缘29之外的前表面22的第二微电子元件14、将微电子元件的触点20、52电连接到端子的第一引线70和第二引线76、以及将第一微电子元件的触点和第二微电子元件的触点电互连的第三引线73。第一微电子元件的触点20可以设置为邻近边缘29。第二微电子元件14的触点26可以设置在其前表面22的中心区域19中。引线70、76、99可以具有与孔39对齐的部分。
摘要（英）：

A microelectronic assembly 10 can include a substrate 30 having first and second surfaces 34, 58, an aperture 39 extending therebetween, and terminals 36. The assembly 10 can also include a first microelectronic element 12 having a front surface 16 facing the first surface 34, a second microelectronic element 14 having a front surface 22 projecting beyond an edge 29 of the first microelectronic element, first and second leads 70, 76 electrically connecting contacts 20, 52 of the microelectronic elements to the terminals, and third leads 73 electrically interconnecting the contacts of the first and second microelectronic elements. The contacts 20 of the first microelectronic element 12 can be disposed adjacent the edge 29. The contacts 26 of the second microelectronic element 14 can be disposed in a central region 19 of the front surface 22 thereof. The leads 70, 76, 99 can have portions aligned with the aperture 39.

公开/授权文献
0/0