The invention provides a manufacturing method for a chip-bearing substrate structure. The chip-bearing substrate structure includes a metal-substrate-structure manufacturing step, a photoresist-pattern-layer forming step, an etching step, a photoresist-pattern-layer removing step, an insulating-material-layer pressing step, a rubbing step, a circuit-layer manufacturing step and a soldermask-layer manufacturing step. The metal-substrate-structure manufacturing step is to manufacture a multiple-layer structure in which two metal substrate layers are provided with a block layer. In the etching step, an etching depth can be controlled effectively so that each position and each paddle structure formed at each time are identical in shape and depth and the substrate structure can be applied in a mass production process and problems, which exist in the prior art, of skewing, incapability of keeping the position fixed and fall-off, which are resulted from different depths, are solved effectively.