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CN103367321B 芯片装置及形成芯片装置的方法 有权

芯片装置及形成芯片装置的方法
摘要：
提供了一种芯片装置及形成芯片装置的方法。所述芯片装置包括：与第一芯片载体顶侧电连接的第一芯片；与第二芯片载体顶侧电连接的第二芯片；被配置为至少部分地环绕第一芯片载体和第二芯片载体的电绝缘材料；被配置为穿过电绝缘材料使第一芯片与第二芯片电接触的至少一个电互连器；形成在第一芯片载体顶侧和第二芯片载体顶侧中的至少一个上并与其电接触的一个或多个第一导电部分；以及形成在第一芯片载体底侧和第二芯片载体底侧中的至少一个上并与其电接触的一个或多个第二导电部分。
摘要（英）：

A chip arrangement is provided. The chip arrangement includes: a first chip electrically connected to the first chip carrier top side; a second chip electrically connected to the second chip carrier top side; and electrically insulating material configured to at least partially surround the first chip carrier and the second chip carrier; at least one electrical interconnect configured to electrically contact the first chip to the second chip through the electrically insulating material; one or more first electrically conductive portions formed over and electrically contacted to at least one of the first chip carrier top side and second chip carrier top side, and one or more second electrically conductive portions formed over and electrically contacted to at least one of the first chip carrier bottom side and second chip carrier bottom side.

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