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发明公开
CN103311191A 半导体装置 有权

半导体装置
摘要：
本发明的目的在于，提供一种能够将半导体元件和电容器接近配置并且具有高装载性的半导体装置。具备：半导体元件；第一电极，电连接于该半导体元件的上表面；第一内部电极，具有多个第一梳齿部和连结该多个第一梳齿部的第一连结部，该第一内部电极电连接于该半导体元件的下表面；第二电极，与该第一内部电极电连接；第二内部电极，具有不与该多个第一梳齿部接触地进入到该多个第一梳齿部之间的多个第二梳齿部、以及连结该多个第二梳齿部的第二连结部，该第二内部电极电连接于该第一电极的下表面；以及下部电介质，填补在该多个第一梳齿部和该多个第二梳齿部之间。
摘要（英）：

The invention provides a semiconductor device capable of closely configuring a semiconductor element and a capacitor and having high loading property. The semiconductor device includes a first electrode electrically connected to an upper surface of a semiconductor element, a first internal electrode electrically connected to a lower surface of the semiconductor element and having a plurality of first comb finger portions and a first connection portion connecting the plurality of first comb finger portions together, a second electrode electrically connected to the first internal electrode, a second internal electrode electrically connected to a lower surface of the first electrode and having a plurality of second comb finger portions and a second connection portion connecting the plurality of second comb finger portions together, the plurality of second comb finger portions being interdigitated with but not in contact with the plurality of first comb finger portions, and a lower dielectric filling the space between the plurality of first comb finger portions and the plurality of second comb finger portions.

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