A sintered compact sputtering target in which a composition ratio based on atomicity is represented by a formula of (Fe100−X—PtX)100−A—CA (provided A is a number which satisfies 20≦A≦50 and X is a number which satisfies 35≦X≦55), wherein C grains are finely dispersed in an alloy, and the relative density is 90% or higher. The production of a magnetic thin film with granular structure is provided without using an expensive simultaneous sputtering device, and a high-density sputtering target capable of reducing the amount of particles generated during sputtering is provided.