Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive layer forming process, in which an adhesive layer (2) is formed on the surface of a base material; a solder layer forming process, in which a solder layer is formed by positioning a plurality of solder powder bodies (3) in such a way that openings are formed between the solder powder bodies; and a filler supplying process in which fillers (4) are supplied between the solder powder into the openings formed on the adhesive layer.