The invention discloses a PCB manufacturing process. The process includes following steps: 1, performing manufacturing steps until a step of dry film lamination before a step of pattern plating according to a conventional PCB manufacturing process; 2, during film manufacturing, taking a board edge reserved according to needs of the manufacturing process as an edge sealing area, and manufacturing the edge sealing area on a film into a light-transmitting area; 3, enabling the edge sealing area to realize film laminating by means of exposure development; 4, subjecting a PCB after development to pattern plating according to a designed plating process; and 5, subjecting the PCB after pattern plating to film-removing and post-process treatment. The PCB manufacturing process is simple and possible to effectively reduce waste of metals such as copper, tin and gold nickel while lowering material cost and guarantee quality of products manufactured by the process, and meets production requirements on environment protection and energy saving.