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发明授权
CN102610588B 半导体器件及其制造方法、用于传输信号的方法 有权

半导体器件及其制造方法、用于传输信号的方法
摘要：
本发明公开了半导体器件及其制造方法、以及用于传输信号的方法。根据本发明的实施例，半导体器件包括：第一半导体芯片，包括第一线圈；第二半导体芯片，包括感应地耦接于第一线圈的第二线圈；以及隔离中间层，位于第一半导体芯片与第二半导体芯片之间。
摘要（英）：

A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip.

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