The present invention relates to a method of manufacturing a solid-state imaging device, a solid-state device made by the method and an electronic apparatus provided with the solid-state imaging device. The method of manufacturing a solid-state imaging device, including, forming on a first substrate a semiconductor thin film which is to be photoelectric conversion sections, forming driving circuits on a face side of a second substrate, laminating the first substrate and the second substrate by disposing the first substrate and second substrate opposite to each other in a condition in which the semiconductor thin film is connected to the driving circuits, and removing the first substrate from the semiconductor thin film in a condition in which the semiconductor thin film is left on the second substrate side. By using the abovementioned manufacturing method of the invention, a solid-state imaging device with excellent photoelectric conversion efficiency and good imaging characteristics can be obtained.