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发明公开
CN102543895A 凸块结构及其制作方法 有权

凸块结构及其制作方法
摘要：
本发明提出一种凸块结构及其制作方法，可改善底切效应且具有较佳的接合可靠度。该制作方法包括：提供一基板。基板具有至少一焊垫与一保护层。保护层具有至少一第一开口以将焊垫暴露。在保护层上形成一绝缘层。绝缘层具有至少一第二开口，且第二开口位于第一开口上方。于绝缘层上形成一金属层。金属层透过第一开口以及第二开口与焊垫电性连接。于第一开口以及第二开口内形成一第一凸块。于第一凸块与部分金属层上形成一第二凸块。以第二凸块为掩模，移除部分未被第二凸块所覆盖的金属层以形成至少一球底金属层。第一凸块被球底金属层以及第二凸块完全包覆。
摘要（英）：

A manufacturing method of a bump structure is provided. A substrate having at least one pad and a passivation layer is provided. The passivation layer has at least one first opening exposing the pad. An insulating layer is formed on the passivation layer. The insulating layer has at least one second opening located above the first opening. A metal layer is formed on the insulating layer. The metal layer electrically connects the pad through the first and second openings. A first bump is formed in the first and second openings. A second bump is formed on the first bump and a portion of the metal layer. The metal layer not covered by the second bump is partially removed by using the second bump as a mask, so as to form at least one UBM layer. The first bump is completely covered by the UBM layer and the second bump.

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