The invention relates to a manufacture method of a three-dimensional integrated circuit structure and material, which comprises the steps of: adding alcohols and/or aldehydes in a thermoplastic loading material, injection-molding into a member by using an injection molding machine, wherein the mass content of the alcohols and/or aldehydes is 5-10 percent; irradiating the surface of the member by using laser to form a line pattern; immersing into a solution of at least one metal ion for soaking for 5-7 minutes, wherein the pH of the solution is 4-6; after washing with water, placing in a water solution containing a reducing agent for soaking for 5-7 minutes, wherein the pH of the water solution is 5; carrying out chemical copper plating in a region where a metal core is generated through reduction, wherein the thickness of a coating is 1-12 micrometers; and carrying out intermediate phosphorus chemical nickel-plating, wherein the thickness of a coating is 2-3 micrometers. According to the invention, in a process of manufacturing a metal circuit conductor, because a plastic material has no metal elements, original mechanical performance of the loading material is kept, stable performance of the loading material is also achieved, adhesive power between a conductor track and the loading material is increased, quality of the three-dimensional integrated circuit is improved, cost is lowered, and pollution is reduced.