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发明公开
CN102481666A 激光加工方法及芯片 有权

激光加工方法及芯片
摘要：
可一边可靠地切断加工对象物，一边提升所得到的芯片的强度。将激光(L)照射于加工对象物(1)，将沿着切断预定线(5)延伸且在厚度方向上排列的改质区域(17、27、37、47)形成于加工对象物(1)。在此，以改质区域形成部分(17a)与改质区域非形成部分(17b)沿着切断预定线交替地存在的方式形成改质区域(17)，以改质区域形成部分(47a)与改质区域非形成部分(47b)沿着切断预定线交替地存在的方式形成改质区域(47)。因此，在进行切断而得到的芯片中，可抑制起因于所形成的改质区域(7)而使背面(21)侧及表面(3)侧的强度降低的情况。另一方面，由于从切断预定线(5)的一端侧遍及另一端侧而连续地形成位于改质区域(17、47)间的改质区域(27、37)，所以可可靠地确保加工对象物(1)的切断性。
摘要（英）：

Disclosed is a laser machining method whereby a workpiece is reliably cut and the strength of a chip obtained is enhanced. Laser light (L) is irradiated on a workpiece (1) to form modified regions (17, 27, 37, 47) which extend along an intended cutting line (5) and are arranged in the thickness direction. The modified region (17) is formed so that modified region forming parts (17a) and modified region non-forming parts (17b) are alternately arranged along the intended cutting line, and the modified region (47) is formed so that modified region forming parts (47a) and modified region non-forming parts (47b) are alternately arranged along the intended cutting line. Thus, it is possible to prevent the strength of a rear surface (21) side and a front surface (3) side of a chip obtained by cutting from being reduced due to the formed modified regions (7). As the modified regions (27, 37) located between the modified regions (17, 47) are formed continuously from one end of the intended cutting line (5) to the other end thereof, the cutting property of the workpiece (1) can be reliably obtained.

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