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发明公开
CN102446875A 半导体装置 有权 复审申请

半导体装置
摘要：
本发明提供能够用简易的方法提高半导体封装部与散热片之间的密合性、提高散热性的半导体装置。本发明所涉及的半导体装置，具备：散热片(13、14)；绝缘片(4)，以暴露散热片(13、14)上表面的一部分的方式与该上表面接合；热分流器(2)，配置在绝缘片(4)上；功率元件(1)，配置在热分流器(2)上；以及传递模塑树脂(8)，覆盖包含散热片(13、14)上表面的一部分的既定的面、绝缘片(4)、热分流器(2)以及功率元件(1)而形成，散热片(13、14)上表面具有为约束绝缘片(4)的边缘部而形成的凸起形状和/或凹陷形状。
摘要（英）：

Provided is a semiconductor device improving the sealingness of the packaged part and the heat radiation sheet and the heat radiation property by means of a simple method, including heat dissipating fins (13,14); an insulating sheet (4) bonded to an upper surface of the heat dissipating fins (13,14), with a part of the upper surface being exposed; a heat spreader (2) located on the insulating sheet (4); a power element (1) located on the heat spreader (2); and a transfer molding resin (8) located to cover a predetermined surface including the part of the upper surfaces of the heat dissipating fins (13, 14), the insulating sheet (4), the heat spreader (2) and the power element (1), wherein the upper surfaces of the heat dissipating fins (13, 14) has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet (4).

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