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发明公开
CN102421560A 喷流焊料槽及锡焊装置 有权

喷流焊料槽及锡焊装置
摘要：
本发明提供能够减少液面高度的误差、能够防止锡焊不良的喷流焊料槽及锡焊装置。操作部用于设定熔融焊料(20)的液面高度。臂(81)移动至与由操作部设定的熔融焊料(20)的液面高度相对应的高度位置且移动至喷嘴(53)的上方。导通传感器(82)设置在臂(81)上，借助该臂(81)移动至喷嘴(53)的上方，与从喷嘴(53)喷流的熔融焊料(20)的液面接触来检测液面的到达情况。由此，能够调整从对印刷电路板进行锡焊的喷嘴(53)喷流的熔融焊料(20)的液面高度。其结果，能够调整从喷嘴(53)喷流的熔融焊料(20)的液面高度，因此与使用辅助喷嘴、虚设喷嘴来间接地调整熔融焊料的液面高度的以往的喷流焊料槽相比，能够减少熔融焊料(20)的液面高度的误差，能够防止锡焊不良。
摘要（英）：

Provided are a jet solder bath and a soldering apparatus, wherein an liquid level error can be reduced and soldering failures can be eliminated. An operating unit sets the liquid level of a melted solder (20). An arm (81) is at a level that corresponds to the liquid level set by means of the operating unit for the melted solder (20) and moves to above a nozzle (53). An electrical continuity sensor (82) is provided on an arm (81), is moved to above the nozzle (53) by means of the arm (81), and detects that the liquid surface reached the level when the sensor is in contact with the liquid surface of the melted solder (20) jetted from the nozzle (53). Thus, the liquid level of the melted solder (20), which is jetted from the nozzle (53) to be soldered on a printed substrate, can be adjusted. As a result, since the liquid level of the melted solder (20) jetted from the nozzle (53) can be adjusted, the error of the liquid level of the melted solder (20) can be reduced compared with conventional jet solder baths wherein the liquid level of the melted solder is indirectly adjusted using sub-nozzles and dummy nozzles, and soldering failures can be eliminated.

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