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CN102299079B 制造具有散热器和半导体芯片的树脂模制装配件的半导体模块的方法 失效 - 权利终止

制造具有散热器和半导体芯片的树脂模制装配件的半导体模块的方法
摘要：
本发明提供制造包括树脂模制封装体和冷却剂通路的半导体模块的方法。所述树脂模制封装体由热固性树脂制成的模件和热塑性树脂制成的模件构成。树脂模制封装体通过制造热塑性树脂制成的模件、放置热塑性树脂制成的模件和由功率半导体芯片、散热器、端子等构成的半导体子装配件，然后形成热固性树脂制成的模件形成。具体而言，热固性树脂制成的模件在热塑性树脂制成的模件之后形成，从而在热固性树脂制成的模件完全硬化之前产生热固性树脂制成的模件对热塑性树脂制成的模件的高度粘合，以在热固性树脂制成的模件和热塑性树脂制成的模件之间牢固形成粘合界面。这使得粘合界面产生气隙的风险最小化并避免冷却剂泄漏到树脂模制封装体之外。
摘要（英）：

A method of producing a semiconductor module which includes a resin molded package and a coolant passage is provided. The resin molded package is made up of a thermosetting resin-made mold and a thermoplastic resin-made mold. The resin molded package is formed by making the thermoplastic resin-made mold, placing the thermoplastic resin-made mold and a semiconductor sub-assembly made up of a power semiconductor chip, heat spreaders, terminals, etc., and then forming the thermosetting resin-made mold. Specifically, the thermosetting resin-made mold is made after the thermoplastic resin-made mold, thereby creating a high degree of adhesion of the thermosetting resin-made mold to the thermoplastic resin-made mold before the thermosetting resin-made mold is hardened completely, thereby forming firmly an adhered interface between the thermosetting resin-made mold and the thermoplastic resin-made mold. This minimizes the risk of occurrence of air gaps at the adhered interface and avoids the leakage of the coolant outside the resin molded package.

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