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发明授权
CN102208389B 半导体封装件、基板及其制造方法 有权

半导体封装件、基板及其制造方法
摘要：
本发明公开一种半导体封装件、基板及其制造方法。该基板包括电性载板、第一金属层及第二金属层。第一金属层形成于电性载板上，第一金属层包括延伸引脚，延伸引脚具有上表面。第二金属层形成于第一金属层上，第二金属层包括接合垫，接合垫重叠于且接触于延伸引脚的上表面，延伸引脚的上表面的一部分露出。接合垫的一部分突出超过延伸引脚的边缘。
摘要（英）：

A semiconductor package, a substrate and a manufacturing method thereof are provided. The substrate comprises a conductive carrier, a first metal layer and a second metal layer. The first metal layer is formed on the conductive carrier and comprises an lead pad having an upper surface. The second metal layer is formed on the first metal layer and comprises a bond pad. The bond pad overlaps and is in contact with the upper surface of the first metal layer. The upper surface of the lead pad is partially exposed. A part of the bond pad overhang outward from the edge of the lead pad.

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