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发明公开
CN102064141A 具有遮蔽电磁干扰的半导体装置封装件 有权

具有遮蔽电磁干扰的半导体装置封装件
摘要：
在此说明用于遮蔽电磁干扰的半导体装置封装件以及其相关的方法。在一实施例中，一半导体装置封装件包括一接地组件，此接地组件设置邻接于一基板单元的周围并且至少部分延伸于基板单元的上表面和下表面之间。此接地组件包括一凹陷部分，此凹陷部分设置邻接于基板单元的侧向表面。此半导体装置封装件还包括一电磁干扰遮蔽件，此电磁干扰遮蔽件电性地连接至接地组件，并且向内凹进地邻接于接地组件的凹陷部分。
摘要（英）：

Described are a semiconductor device package for shielding electromagnetic interference and a related method. In one embodiment, the semiconductor device package includes a grounding element which is disposed adjacent to the periphery of a substrate unit and at least partially extends between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an electromagnetic interference shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.

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