The piezoelectric vibrators manufacturing method comprises a recess forming step of forming a plurality of cavity recesses for forming the cavities when the two wafers are overlaid, in the lid substrate wafer, a through electrode forming step of forming a plurality of through electrodes in and through the base substrate wafer, a drawing electrode forming step of forming a plurality of drawing electrodes connected electrically with the through electrodes, on the upper face of the base substrate wafer, a mounting step of jointing the plural piezoelectric vibration members to the upper face of the base substrate wafer through the drawing electrodes, an overlaying step of overlaying the base substrate wafer and the lid substrate wafer thereby to house the piezoelectric vibration members in the cavities surrounded by the recesses and the two wafers, a jointing step of jointing the base substrate wafer and the lid substrate wafer thereby to seal the piezoelectric vibration members in the cavities, an external electrode forming step of forming a plurality of external electrodes connected electrically with the through electrodes, on the lower face of the base substrate wafer, and a cutting step of cutting the two jointed wafers thereby to shred the two wafers into the plural piezoelectric vibrators. The through electrode forming step includes a through hole forming step of forming a plurality of through holes in and through the base substrate wafer, a setting step of arranging core members, which are formed to have two flat ends and a thickness substantially equal to that of the base substrate wafer, in those plural through holes, and arranging connecting members between the core members and the through holes, and a sintering step of sintering the connecting members at a predetermined temperature thereby to fix the through holes, the connecting members and the core members integrally.