知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN101932204A 电路板制造方法 无效 - 撤回

电路板制造方法
摘要：
一种电路板制造方法，应用于电路板上，该电路板制造方法在该电路板进入波峰焊之前，在该电路板上设置具有开口的预定区域，并提供具有对应该开口的插脚的加强件，且通过该开口与该插脚的结合，将该加强件设置于该预定区域，并在该电路板完成波峰焊后，取下该加强件，由此增加该电路板的强度，使电路板在波峰焊的进行过程中不易弯曲，进而提高产品良率。
摘要（英）：

The invention relates to a circuit board manufacturing method which is applied to a circuit board and comprises the following steps of: arranging a preset area with an opening on the circuit board before the circuit board is subject to wave soldering, providing a reinforcement with a pin corresponding to the opening, and arranging the reinforcement in the preset area through the combination of the opening and the pin; and taking down the reinforcement after the circuit board is subjected to the wave soldering. Thus, the strength of the circuit board is enhanced, the circuit board is not easy to bend during the wave soldering, and the yield of the product is improved.

0/0