Provided is a film-packaged type source driver, in which a semiconductor chip having a plurality of terminals to be connected with the outside is mounted on the surface of a film base. The source driver includes an input terminal wiring region having wiring lines formed to be connected with the input terminals of the semiconductor chip, and an output terminal wiring region having wiring lines formed to be connected with the output terminals of the semiconductor chip. On the two ends of the film base, sprocket portions are formed to have continuous holes and a copper foil on the surfaces. The input terminal wiring region and the output terminal wiring region are formed in mutually reverse directions toward the sides having no sprocket portion. A heat conduction pattern is formed to connectthe terminals of the semiconductor chip other than the input terminal and the output terminal, with the copper foil of the sprocket portion. Thus, it is possible to provide not only the source drivercapable of increasing the heat release but also a source driver manufacturing method, and a liquid crystal module.