The invention discloses grout silver paste applied to a thick film circuit, which consists of 60 to 90 weight percent of conductive powder, 1 to 6 weight percent of frit and 10 to 35 weight percent of organic carrier, wherein the total weight of the conductive powder, the frit and the organic carrier is 100 percent. The conductive powder is the powder of gold, silver, palladium, copper, nickel, tungsten and manganese alloys or the mixed powder of the powder; and the grain diameter of the conductive powder is controlled to be 1 to 10mu m. The grout silver paste applied to the thick film circuit prepared by the invention has the characteristics of high electrical conductivity, low sintering shrinkage rate and good matrix matching performance and the using requirement of a grout process of the thick film circuit is met in the using process.