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发明公开
CN101866898A 用于C4球中均匀电流密度的金属布线结构 有权 转让

用于C4球中均匀电流密度的金属布线结构
摘要：
在一实施例中，金属结构的焊垫下组件直接位于金属焊垫下面。焊垫下组件包括邻接所述金属焊垫的上层金属线结构，位于上层金属线结构下面的下层金属线结构，和提供位于上层金属线结构和下层金属线结构之间的电连接的金属通路孔组。在另一实施例中，通过采用一组集成的金属通路孔的金属焊垫结构，金属通路孔被分段并且被分布从而促进C4球内均匀的电流密度分布，C4球的可靠性被提高。多个金属通路孔的截面的面密度在金属焊垫的中心部比在金属焊垫的平面部的周边部高。
摘要（英）：

In one embodiment, a sub-pad assembly of metal structures is located directly underneath a metal pad. The sub-pad assembly includes an upper level metal line structure abutting the metal pad, a lower level metal line structure located underneath the upper level metal line structure, and a set of metal vias that provide electrical connection between the lower level metal line structure located underneath the upper level metal line structure. In another embodiment, the reliability of a C4 ball is enhanced by employing a metal pad structure having a set of integrated metal vias that are segmented and distributed to facilitate uniform current density distribution within the C4 ball. The area1 density of the cross-sectional area in the plurality of metal vias is higher at the center portion of the metal pad than at the peripheral portion of the planar portion of the metal pad.

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