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发明授权
CN101853835B 倒装芯片封装的制造方法 有权

倒装芯片封装的制造方法
摘要：
本发明揭示一种倒装芯片封装的制造方法，包含下列步骤：于一绝缘层或一可挠基板的中间形成一槽孔及多个通孔；压合两金属薄膜于该绝缘层的两个表面；图案化一该金属薄膜为多个第一接垫及多个连接线路，及图案化另一该金属薄膜为多个第二接垫，其中该多个第一接垫是延伸于该槽孔上，并和该多个连接线路相连接；于该多个通孔填充多个导通柱以连接该多个连接线路及该多个第二接垫；以及使用一具有一支持部的夹具，经槽孔顶抵住该第一接垫延伸于该槽孔上的部分，并倒装焊该芯片于该多个第一接垫上。
摘要（英）：

The present invention discloses a method for manufacturing a flip-chip package, which comprises the following steps: forming a slotted hole and a plurality of through holes at the center of an insulating layer or a flexible substrate; pressing two metallic films on the two surfaces of the insulating layer; patterning one metallic film with a plurality of first bonding pads and a plurality of connecting lines; and patterning the other metallic film with a plurality of second bonding pads, wherein the plurality of first bonding pads are extended to the slotted hole and are connected with the plurality of connecting lines; filling a plurality of conducting columns into the plurality of through holes so as to connect the plurality of connecting lines and the plurality of second bonding pads; and supporting the parts of the first bonding pads extended to the slotted hole by means of a clamp passing through the slotted hole and provided with a first supporting part and welding the chip onto the plurality of first bonding pads through the flip-chip bonding technology.

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