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发明公开
CN101827958A 金属包覆的聚酰亚胺复合体、该复合体的制造方法以及电子电路板的制造方法 无效 - 驳回 转让 复审申请

金属包覆的聚酰亚胺复合体、该复合体的制造方法以及电子电路板的制造方法
摘要：
本发明的目的在于提供金属包覆的聚酰亚胺复合体、该复合体的制造方法以及电子电路板的制造方法，所述金属包覆的聚酰亚胺复合体具有通过非电解镀敷或干式法形成于聚酰亚胺膜的表面上的连接层及金属种层、和进一步通过电镀形成于其上的铜或铜合金层，其中，所述铜或铜合金镀敷层具备3层～1层的铜或铜合金层，在铜或铜合金层为3层～2层的情况下，在该铜或铜合金层的边界具有杂质富集部，在铜或铜合金层为1层的情况下，不具有杂质富集部。所述金属包覆的聚酰亚胺复合体、该复合体的制造方法以及电子电路板的制造方法可以防止无粘接剂挠性层压板(特别是双层挠性层叠体)的剥离、特别是可以有效地抑制从铜层和镀锡的界面剥离。
摘要（英）：

Provided is a metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method, and a copper layer or a copper alloy layer formed thereon by electroplating, wherein the copper plated layer or copper alloy plated layer comprises three layers to one layer of the copper layer or copper alloy layer, and there is a concentrated portion of impurities at the boundary of the copper layer or copper alloy layer when the copper layer or copper alloy layer is three layers to two layers, and there is no concentrated portion of impurities when the copper layer or copper alloy layer is a single layer. The provided metal covered polyimide composite can effectively prevent peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), particularly can effectively inhibit peeling from the interface of a copper layer and tin plating. Additionally provided are a method of producing the composite and a method of producing an electronic circuit board.

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