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发明授权
CN101772831B 切割和芯片接合用带以及半导体芯片的制造方法 有权

切割和芯片接合用带以及半导体芯片的制造方法
摘要：
提供一种切割和芯片接合用带，在对半导体晶片进行切割，并连同芯片接合膜一起拾取半导体芯片时，通过所述切割和芯片接合用带可以容易地且切实地对半导体芯片进行拾取。一种切割和芯片接合用带，该切割和芯片接合用带具备粘合剂层和层叠在该粘合剂层上的非粘性层；其中，所述非粘性层由含有丙烯酸类聚合物作为主成分的组合物形成，在拾取半导体芯片时的温度下，所述非粘性层的储能模量为1～400MPa，且断裂伸长率为5～100％。
摘要（英）：

Provided is a dicing/die bonding tape for easily and surely picking up a semiconductor chip, in the case of dicing a semiconductor wafer and picking up the semiconductor chip together with a die bonding film. The dicing/die bonding tape is provided with a cohesive/adhesive layer, and a non-cohesive layer laminated on the cohesive/adhesive layer. The non-cohesive layer is formed of a composition containing acrylic ester polymer as a main component, and the non-cohesive layer has a storage elastic modulus of 1-400MPa and a fracture elongation of 5-100% at a temperature when the semiconductor chip is picked up.

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