The invention relates to a semiconductor chip structure. A chip makes a semiconductor baseplate into a needed semiconductor chip by carrying out repeated epitaxial growth, photolithography, etching, impurity diffusion, repeat selective adulterant diffusion, evaporation and other processes; electrodes and wires are formed on the surface of the chip; a prevention layer covers an insulating layer, the electrodes and the lateral wall of the chip; a plurality of large-area conductive pads are arranged opposite to the top of the prevention layer of the insulating layer and the electrodes; the area of the conductive pads is larger than that of the electrodes; the conductive pads respectively penetrates through a connecting part passing though the prevention layer to form an electrical connection with corresponding electrodes; and thus, the semiconductor chip structure with the prevention layer and the large-area conductive pads is formed. The invention finishes the back-end process of an active semiconductor component by using the large-area conductive pads of the chip to directly connect and conduct and to be fixed on a printed circuit of a circuit board, thereby reducing common packaging process of welding wires and welded ball (bulges), improving the process yield and reducing the production cost.