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发明公开
CN101740428A 用于铜丝键合的金属压焊块厚铝工艺 有权 转让

用于铜丝键合的金属压焊块厚铝工艺
摘要：
本发明涉及一种本发明涉及集成电路的生产方法，具体地说是一种用于铜丝键合的金属压焊块厚铝工艺，本发明可以解决芯片键合工艺中铜丝键合要求的压焊块区域厚金属的问题。本发明通过在钝化层上溅射一层厚度为2μm的第二铝层，使第一铝层与第二铝层作为金属焊块部分的整体厚度为3μm，达到铜丝焊压技术的要求。本发明节约成本，便于实现焊接技术的自动化，可以减缓金属化合物的生成，提高键合强度，保证了小尺寸芯片的电路特性，工艺简单，操作方便。
摘要（英）：

The invention relates to a method for producing an integrated circuit, in particular to an aluminum thickening process for a metal pressure-welding block for bonding a copper wire. The process can solve the problem of thickening a metal in a pressure-welding block region required for bonding the copper wire in a chip bonding process. A second aluminum layer with the thickness of 2mum is sputtered on a passivation layer so that the integral thickness of a first aluminum layer and the second aluminum layer used as the metal welding block parts is 3mum and the requirement of the copper wire welding-pressing technology is met. The process saves the cost, conveniently realizes automation of the welding technology, can slow down the generation of metal compounds, improves the bonding strength, ensures the circuit specification of a small-sized chip, and is simple and convenient to operate.

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