The invention provides a glue solution for a reinforced plate. Better bonding property and heat-resistant property are produced between the reinforced plate dipped with the glue solution and a copper foil layer. The glue solution consists of the following components by weight part: 5,820 parts of 14PTMR resin, 251 parts of methanol, 124 parts of triphenyl phosphate, 229 parts of tetrabromobisphenol A solution, 535 parts of pentabrominated diphenyl ether solution and 917 parts of brominated epoxy solution, wherein the 14PTMR resin comprises the following components by weight part: 3,264 parts of 14PT resin, 140 parts of M302 resin, 1,128 parts of 500g/l formaldehyde, 27.4 parts of triethylamine, 50.7 parts of 250g/l ammonia water, 1,934 parts of methanol and 70 parts of mold releasing agent. The glue solution is applied to occasions of the great heat dissipating capacity of electronic components and parts and poor working conditions.