The invention provides nano-silver conductive slurry, which comprises the following components in percentage by weight: 10 to 70 percent of nano-silver granules serving as a functional phase, and the balance of carrier phase. The nano-silver granules are uniformly dispersed in the carrier phase by methods of mechanical stirring, ultrasonic dispersion and the like to form the nano-silver conductive slurry; the slurry is molded by methods of spin coating, screen printing, micro thinning and micro-spray direct writing and the like, and then the molded slurry is thermally treated at the temperature of below 250 DEG C by a programmed heating method to form conductive patterns with good conductivity (the electrical resistivity is at a magnitude order of 0 to 50 ohm.cm) and high resolution (the maximum resolution is 30 mu m).