The invention discloses a circuit board structure and a technology thereof. The circuit board structure comprises an overlaid layer, fine circuit patterns and a patterning conducting layer, wherein the fine circuit patterns are embedded into the overlaid layer; and the patterning conducting layer is configured on the surface of the overlaid layer. The circuit board structure forms fine circuit slots on the surface of the overlaid layer and then fills conducting materials into the fine circuit slots to form the fine circuit patterns embedded into the overlaid layer, and because the fine circuit patterns have thinner line width and narrower line space, a circuit board has higher wiring density.