The invention relates to an adhesive for packaging a smart card module, which comprises the following components in percentage by weight: 15 to 40 percent of superfines of epoxy resin, 15 to 32 percent of amine liquid curing agent and 28 to 54 percent of packing material; or 5 to 14 percent of the superfines of epoxy resin, 10 to 16 percent of the amine liquid curing agent and 70 to 80 percent of silver powder. The adhesive is prepared by suspending the superfines of the epoxy resin of which the melting point or the softening point is less than 150 DEG C into the organic amine liquid curing agent; under the conditions of a low temperature or normal temperature, because the superfines of the epoxy resin is not dissolved in the amine liquid curing agent, the reaction rate of the resin and the curing agent is reduced so that the adhesive has more than 24 hours of working time at the normal temperature to reduce the waste caused by a short product usage period; and during heating and curing, the superfines of the epoxy resin can be melted and liquefied quickly and react with the curing agent quickly to achieve the requirement on the on-line curing of the adhesive.