The invention discloses an array package substrate which comprises a patterning metal connecting layer, a plurality of connecting gaskets, a first insulation layer, a plurality of conductive projections and a second insulation layer. The patterning metal connecting layer is provided with a first surface and a second surface which corresponds to the first surface, the connecting gaskets are arranged on the first surface, the conductive projections are arranged on the second surface and are electrically connected with the connecting gaskets through the patterning metal connecting layer, wherein each conductive projection is provided with a connecting part and a projection part, and the connecting part of each conductive projection is connected with the patterning metal connecting layer. In addition, the first insulation layer is arranged at one side of the surface planar with the first surface or second surface and protrudes from the connecting gaskets. The second insulation layer is arranged at the other side of the surface and protrudes from the projection part of each conductive projection.