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发明公开
CN101529573A 电子器件模块及其制造方法 无效 - 驳回

电子器件模块及其制造方法
摘要：
本发明涉及一种电子器件模块，其包括至少一个多层的陶瓷电路支承体(2，3)和带有至少一个冷却体(4)的至少一个冷却装置，其中在陶瓷电路支承体(2，3)和冷却装置(4)之间至少局部地设置有复合层(5，6)，该复合层被构建为用于在主要工艺中与陶瓷电路支承体(2，3)反应性地连接，并且被构建为用于与冷却装置(4)连接。本发明还涉及一种用于制造这种电子器件模块的方法。
摘要（英）：

The invention relates to an electronic component module with at least one multi-layer ceramic circuit carrier (2, 3) and at least one cooling device comprising at least one cooling body (4). A composite layer (5, 6) is arranged at least in some regions between the ceramic circuit carrier (2, 3) and the cooling device (4). Said composite layer is designed for a reactive connection with the ceramic circuit carrier (2, 3) during a primary process and for connection with the cooling device (4). The invention also relates to a method for the production of said electronic component module.

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