This invention provides a surface treated copper foil which, without use of chromium in an antirust treated layer in an electrolytic copper foil, is excellent in good properties after fabrication into a printed wiring board, for example, in peel strength of a circuit and the percentage deterioration in chemical resistance regarding the peel strength. In the surface treated copper foil, an antirust treated layer and a silane coupling agent layer are provided on a face of lamination of an electrolytic copper foil onto an insulating resin base material. The surface treated copper foil is characterized in that the antirust treated layer comprises a nickel alloy layer having a weight thickness of 5 mg/m<2> to 50 mg/m<2> and a tin layer having a weight thickness of 5 mg/m<2> to 40 mg/m<2> stacked in that order and a silane coupling agent layer is provided on the surface of the antirust treated layer. Further, the present invention further provides, for example, a surface treated copper foilwith a very thin primer resin layer, characterized in that a very thin primer resin layer having an equivalent thickness of 1 [mu]m to 5 [mu]m is provided on a face of lamination of the surface treated copper foil (not subjected to roughening treatment) on the insulating resin base material.