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发明授权
CN101515553B 一种贴片式二极管的加工方法 有权

一种贴片式二极管的加工方法
摘要：
一种贴片式二极管的加工方法。涉及批量生产贴片式二极管的加工方法。结合专用工装，能够大批量、高效生产出合格品。本发明需芯片吸模、焊接模、翻转套模、测试板和包装盒，按1)、组装；2)、焊接；3)、转运；4)、检测；5)、包装的步骤加工。本发明所要加工的产品尺寸小，难以拈捡，特制作了批量转接工装，从芯片归置到焊接、检测、成品包装，所有工序均采用批量转接，使得加工的效率大幅度提高。根据贴片式二极管的结构特性，提供了测试板，它具有一个便于批量定位的布设有若干排凸字形槽的绝缘面板，产品可置入该面板的槽内；在槽底设置了两个面：一个绝缘面、一个导电面。本发明加工效率高，非接触式加工使得产品质量得到进一步保障。
摘要（英）：

A method for processing a chip diode relates to a method for processing chip diodes in batch production. Bulk quality products can be efficiently produced through the method in combination with special tools. In the invention, a chip absorbing die, a welding die, a turning cover die, a testing board and a packing box are processed according to the steps of (1) assembling; (2) welding; (3) transporting; (4) detecting; and (5) packaging. Products to be processed in the invention have small sizes and are difficult to pick up, so that special tools for batch transit are manufactured and all procedures, including chip arrangement, welding, detection and packaging, adopt the batch transit, so as to greatly improve the processing efficiency. According to the structural property of the chip diode, the testing board is provided. A plurality of rows of grooves of convex shape are formed on an insulating panel of the testing board which facilitates batch positioning; the products can be placed in the grooves of the panels; and two surfaces, namely an insulating surface and a conductive surface, are formed on the bottom of each groove. The invention has high processing efficiency; and non-contact processing further ensures the quality of the product.

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