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发明授权
CN101488484B 元件搭载用基板、半导体模块及便携装置 失效 - 权利终止

元件搭载用基板、半导体模块及便携装置
摘要：
本发明涉及元件搭载用基板、半导体模块及便携装置，其中，元件搭载用基板包括：由绝缘性树脂形成的绝缘层、覆盖绝缘层表面的玻璃纤维布以及设置在贯穿玻璃纤维布的贯穿部的电极。所述玻璃纤维布与焊料的接触角比树脂与焊料的接触角大，因此，在元件搭载用基板的电极上容易精度良好地形成焊料凸起。
摘要（英）：

The invention relates to a device mounting board, a semiconductor module and a portable device, wherein the device mounting board includes an insulating layer formed of an insulating resin, a glass fiber cloth covering the surface of the insulating layer, and an electrode provided in a through hole extending through the glass cloth. The angle of contact with solder of the glass cloth is larger than that of the resin. Thus, solder bumps are formed on the electrode of the device mounting board 10 with high precision.

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