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发明授权
CN101442879B 线路板及其导电通孔结构 失效 - 权利终止 转让

线路板及其导电通孔结构
摘要：
本发明公开了一种线路板，其具有至少一贯孔，并包括一第一线路层、一第二线路层、一绝缘层以及一导电通孔结构。绝缘层配置于第一线路层与第二线路层之间。贯孔位于绝缘层中，并从第一线路层延伸至第二线路层。导电通孔结构包括至少一第一接线垫、至少一第二接线垫以及一导电图案。第一接线垫局部覆盖贯孔的一开口的边缘，并连接第一线路层。第二接线垫局部覆盖贯孔另一开口的边缘，并连接第二线路层。导电图案连接第一接线垫与第二接线垫，并局部覆盖贯孔的孔壁。通过导电通孔结构，线路板的线路密度得以提高。
摘要（英）：

The invention discloses a circuit board having at least one through hole and comprising a first circuit layer, a second circuit layer, an insolating layer and a conducting through hole structure. The insolating layer is disposed between the first and the second circuit layers; the through hole is positioned in the insolating layer extending from the first circuit layer to the second circuit layer; the conducting through hole structure comprises at least one first wiring pad, at least one second wiring pad and a conducting pattern; the first wiring pad covers the edge of one opening of the through hole partly, and is connected with the first circuit layer; the second wiring pad covers the edge of another opening of the through hole partly, and is connected with the second circuit layer; the conducting pattern is connected to the first and the second wiring pad, and covers the wall of the through hole partly. By the conducting through hole structure, the circuit density of the circuit board is increased.

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