The invention relates to a method for cutting small window encapsulating and a formed encapsulating structure. According to the method, a substrate strip is provided with a plurality of small windows at the sides or corners, and one externally-connecting surface of the substrate strip comprises a plurality of window encapsulating areas which surround the small windows and extend to cutting channels. A plurality of wafers are arranged on the substrate strip, and form a plurality of electrically-connected elements in the small windows. Afterwards, an adhesive body is formed on the encapsulatingarea of the small windows of the substrate strip and in the small windows, so as to seal the electrically-connecting elements and extend to the cutting channels. When monomeric separation is performed, the part of the adhesive body in the window encapsulating area is cut simultaneously. Therefore, glue overflow generated on the periphery of the small window can be effectively reduced so as to increase the combination area of the adhesive body to the substrate strip, and prevent the stripping of a substrate unit line and a welding-proof layer.