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发明授权
CN101409225B 紫外线照射方法及使用了该方法的装置 失效 - 权利终止

紫外线照射方法及使用了该方法的装置
摘要：
本发明提供一种紫外线照射方法及使用了该方法的装置，利用紫外线发生装置对保护带表面照射紫外线。另外，利用照射枪使紫外线强度高于紫外线发生装置的紫外线的强度形成点径状而照射到晶圆边缘。此时，由控制装置控制紫外线强度和保持台的旋转速度，使得晶圆边缘部分的每单位面积的紫外线照射量与保护带的粘贴面的每单位面积的紫外线照射量相等。
摘要（英）：

The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.

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