The invention relates to a method for producing printed circuit boards, which includes many wet process working procedures with a provided copper coated base plate: spreading photoresistance with the copper coated base plate, carrying out the exposure imaging for the photoresistance, etching the clutch gold of the copper coated base plate for forming a conducting wire, removing photoresistance and carrying out the planting treatment, and carrying the superficial treatment before one or a number of wet process working procedures, for the surface of the copper coated base plate needed to be treated in the wet process working procedures using the ordinary pressure plasma. The invention improves the performances of copper coated base plate surface, thereby reducing wrapping angles between various kinds of liquid finishing agents on the copper coated base plate surface and in many wet process working procedures, and improving the quality of the produced printed circuit boards.