The invention provides an image sensing element package and a manufacturing method thereof. The image sensing element package comprises: a substrate above which an image sensing element connected with a metal layer electrically is formed; a plurality of groove insulating layers formed in the substrate and enclosing a part of substrate; a through hole formed in the substrate within an isolation area and connected the metal layer electrically; and a solder ball connected with the image sensing element electrically through the through hole. In the image sensing element package, because the solder ball can be connected with the image sensing element electrically through the through hole formed within the isolation area, the signal of the image sensing element can be transmitted to the outsidethrough the metal layer and the through hole, without passing by the outside of the substrate forming the image sensing element. Therefore, the signal transmission pathway of the image sensing element can be shortened. Moreover, the substrate is processed by a thinning step, so the thickness of the substrate can be reduced. Therefore, the size of the image sensing element can be also reduced.