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发明公开
CN101357423A 无铅锡焊料 失效 - 权利终止

无铅锡焊料
摘要：
对熔断器镀镍铜帽具有高润湿性、且强度和塑性高的无铅锡焊料以其重量为基准，含：Cu3.0－5.0％，Sb0.05－1.5％b，Bi0.05－1.8％，Ag0.1－0.15％g，RE0.002－0.25％，余量为Sn。本发明适用于电子行业无铅化封装。
摘要（英）：

The invention discloses a lead-free tin solder with high wetting property to a fuse nickel plated copper cap as well as high strength and plasticity which comprises 3.0-5.0 percent of Cu, 0.05 --1.5 percent of Sb, 0.05-1.8 percent of Bi, 0.1-0.15 percent of Ag, 0.002-0.25 percent of RE, and Sn taking the rest amount according to weight. The lead-free tin solder is applicable to the lead-free encapsulation in the electronic industry.

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