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发明授权
CN101357421B 无铅锡焊料 失效 - 权利终止

无铅锡焊料
摘要：
对熔断器镀镍铜帽具有高润湿性、且强度和塑性高的无铅锡焊料以其重量为基准，含：Cu 3.0-5.0％，Sb 2.8-3.0％，Bi 3.3-3.5％i，Ag 0.1-2.0％，余量为Sn。本发明适用于电子行业无铅化封装。
摘要（英）：

The invention discloses a lead-free tin solder with high wettability to a fuse nickel-plated copper cap, high strength and plasticity which comprises 3.0-5.0 percent of Cu, 1.5-3.0 percent of Sb, 1.8-3.5 percent of Bi, 0.1-4.0 percent of Ag, and the balance Sn by weight. The lead-free tin solder is applicable to the lead-free encapsulation in the electronic industry.

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