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发明授权
CN101355058B 半导体装置及其制造方法 失效 - 权利终止

半导体装置及其制造方法
摘要：
本发明的目的在于提供一种可靠性高的半导体装置及其制造方法。在现有的半导体装置中，玻璃基板构成的支承体处于切割后的露出状态。因此，由于通过切割等露出有损伤的玻璃侧面，故因来自外部的物理性冲击，恐怕会导致玻璃缺口、破碎。本发明的半导体装置具有：与半导体芯片内的电路元件连接且形成于该半导体芯片上的侧面部附近的焊盘电极；形成于焊盘电极上的支承体；形成于半导体芯片的侧面部和背面部的绝缘膜；与焊盘电极的背面连接、从半导体芯片的侧面部向背面部延伸而与绝缘膜相接的配线层；形成于支承体的侧面部的第二保护膜。根据本发明，由于覆盖支承体的侧面部而形成保护膜，故可以防止来自外部的物理性冲击直接施加于支承体。
摘要（英）：

The invention provides a semiconductor device having high reliability and a method of manufacturing the same. The semiconductor device of the invention has pad electrodes formed on a semiconductor die near the side surface portion thereof and connected to a semiconductor integrated circuit or the like in the semiconductor die, a supporting body formed on the pad electrodes, an insulation film formed on the side and back surface portions of the semiconductor die, wiring layers connected to the back surfaces of the pad electrodes and extending from the side surface portion onto the back surfaceportion of the semiconductor die so as to contact the insulation film, and a second protection film formed on the side surface portion of the supporting body.

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