Disclosed is an electroplating device, which is used for electroplating a base board of a flexible circuit board. The surface of the base board of the flexible circuit board to be processed comprises at least one first transmission area and at least one second transmission area, the electroplating device comprises a plating tank which includes a tank body and an anode arranged in the tank body, and the device has the improvement that the electroplating device also comprises a shading device which includes at least one first shading plate and at least one second shading plate, the first shading plate and the second shading plate are arranged on the surface of the base plate of the flexible circuit board to be process, the first shading plate is arranged at the position 5 to 20mm from the surface of base board of the flexible circuit board to be processed and relative to the first transmission area, and the second shading plate is disposed at the position 5 to 20mm from the surface of base board of the flexible circuit board to be processed and relative to the second transmission area, the width of the first shading plate is equal to or larger than that of the first transmission area, the width of the second shading plate is equal to or larger than that of the second transmission area, and the material of the first shading plate and the second shading plate adopts insulating material.